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Intel® Xeon® Processor 5600 Series [84 K]
Discover how the Intel® Xeon® processor 5600 series automatically regulates power consumption and intelligently adjusts server performance.

Discover how the Intel® Xeon® processor 5600 series automatically regulates power consumption and intelligently adjusts server performance.

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Intel® Xeon® Processor E7 Family Specifications [88 K]
Intel® Xeon® processor E7 family specifications

Intel® Xeon® processor E7 family specifications

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iSCSI for VMware*: Quick Connect Guide
Guide: Introduction to iSCSI storage connectivity from VMware* server administrator’s perspective shows basic connection from OS to a storage target.

Guide: Introduction to iSCSI storage connectivity from VMware* server administrator’s perspective shows basic connection from OS to a storage target.

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Intel® E7501 Chipset [100 K]
The Intel® E7501 Chipset supports dual-processor server systems optimized for the Intel® Xeon® processor.

The Intel® E7501 Chipset supports dual-processor server systems optimized for the Intel® Xeon® processor.

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Intel® E8870 Chipset [89 K]
The Intel® E8870 Chipset represents a chipset architecture specifically designed to meet the needs of high-end, 2-way and 4-way server systems.

The Intel® E8870 Chipset represents a chipset architecture specifically designed to meet the needs of high-end, 2-way and 4-way server systems.

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Intel's Packaging Databook Chapter 1: Introduction
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 6: ESD/EOS
Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel® Itanium® 9300 Family Whitepaper
The Intel® Itanium® processor family provides the foundation for mainframe-class computing systems that offer greater flexibility and better cost models than t...

The Intel® Itanium® processor family provides the foundation for mainframe-class computing systems that offer greater flexibility and better cost models than traditional mainframe and high-end RISC systems. Systems based on this new processor are ideal for running demanding enterprise applications, such as database, business intelligence, and enterprise resource planning.

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Intel® Itanium® Architecture Developer's Manual: Vol. 2
Intel® Itanium® Architecture definition, application level resources, programming environment, and IA-32 application interface.

Intel® Itanium® Architecture definition, application level resources, programming environment, and IA-32 application interface.

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Intel® Itanium® Architecture Software Developer's Manual
Manual: Intel® Itanium® Architecture Software Developer's Manual, Volumes 1-4: combined reference set.

Manual: Intel® Itanium® Architecture Software Developer's Manual, Volumes 1-4: combined reference set.

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Intel® Itanium® Architecture Developer's Manual, Vol. 3
Intel® Itanium® Architecture Software Developer's Manual, Vol. 3: Intel® Itanium® Instruction Set.

Intel® Itanium® Architecture Software Developer's Manual, Vol. 3: Intel® Itanium® Instruction Set.

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Intel® Itanium® Architecture Software Developer's Manual Volume 4
Manual: Intel® Itanium® Architecture Software Developer's Manual, Vol. 4: IA-32 Instruction Set.

Manual: Intel® Itanium® Architecture Software Developer's Manual, Vol. 4: IA-32 Instruction Set.

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Intel® Itanium® Processor: Specification Update
Intel® Itanium® processor provides device and documentation errata, specification clarifications, and changes.

Intel® Itanium® processor provides device and documentation errata, specification clarifications, and changes.

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Itanium® Software Conventions and Runtime Architecture Guide
Architecture Guide: Intel® Itanium® software conventions and runtime. Does not define operating-system interfaces.

Architecture Guide: Intel® Itanium® software conventions and runtime. Does not define operating-system interfaces.

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Intel® Itanium® Processor Family SAL Specification
Specification functionality of the System Abstraction Layer for Intel® Itanium® architecture-based systems.

Specification functionality of the System Abstraction Layer for Intel® Itanium® architecture-based systems.

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Intel's Packaging Databook Chapter 15: The Chip Scale Package (CSP)
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

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Intel's Packaging Databook Chapter 13: Pinned Packaging
Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.

Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.

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Intel's Packaging Databook Chapter 11: International Packaging Specifications
Packaging Databook, Ch. 11: international packing specifications with rules and standards.

Packaging Databook, Ch. 11: international packing specifications with rules and standards.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Entry-level Intel® Processor-based HPC Cluster Platforms
Product Brief: Pentium® D processor with an Intel® Server Board SE7230CA1-E delivers performance and reduced footprint for essential applications.

Product Brief: Pentium® D processor with an Intel® Server Board SE7230CA1-E delivers performance and reduced footprint for essential applications.

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Design Guide: mPGA604 Socket for Intel® Xeon® Processors
Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.

Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.

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LGA771 Socket Mechanical Design Guide
This document describes a surface mount, LGA socket intended for the Dual-Core Intel® Xeon® Processor 5000 Sequence Family.

This document describes a surface mount, LGA socket intended for the Dual-Core Intel® Xeon® Processor 5000 Sequence Family.

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Caszone Achieves Positive ROI with Intel® vPro™ Technology
Case Study: By deploying PCs with Intel® vPro™ technology, Caszone hit a positive ROI of 160% in four years.

Case Study: By deploying PCs with Intel® vPro™ technology, Caszone hit a positive ROI of 160% in four years.

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