IXP43X Product Line Thermal Design Application Note
The document describes thermal design and characteristics of the IXP43X product line of network processors and suggests solutions for adequate cooling to maintain case temperature at optimal levels.
Read the full IXP43X Product Line Thermal Design Application Note.
Demonstrates attachment of strain gauges to measure manufacturing board flexure. (v.1, Jan. 2011)
Ishu Verma discusses Android* SDK and NDK toolsets as well as the benefits of using NDK. (v.001, Oct. 2011)
Demonstrates how to use a USB drive to boot a customer reference board to DOS. (v.1, June 2010)
Demo: Walks through key features and use of the planner to create boards. (v.2, Sept. 2013)
Demos setup, software, oscilloscope settings, and power delivery assessments. (v.001, Mar. 2010)
Discusses increasing throughput for multi-core processors. (v.1, June 2009)