See the performance improvement of parallel computing with code optimized to take advantage of the multiple cores of modern Intel® processors.
Shows how parallel computing offers a massive performance improvement with code optimized to take advantage of the multiple cores, threads, and wide vector units of modern Intel® architecture-based processors, such as the Intel® Xeon Phi™ processor.
Brief: Accelerate silicon design on the Intel® Xeon® processor E7-4800 v2 product family for greater throughput to bring products to market faster.
Brief: Accelerate long-running silicon design jobs on the Intel® Xeon® processor E7-4800 v2 product family, delivering throughput improvements to help reduce new design time to market.
Study: SPAR Magyarország uses Intel® Xeon® processor E7 family to keep mission-critical data on the move with superior performance and scalability.
Study: Intel® Xeon® processor E7 family helps keep mission-critical data on the move, underpinning non-stop retail for SPAR Magyarország with superior performance, scalability, memory, and I/O capability for applications.
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Chapter 3 Alumina & Leaded Molded Technology: Statistical tools used in the manufacturing process. Also included is a comprehensive analysis of Intel’s IC assembly manufacturing technology and process flow.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Chapter 7 Leaded Surface Mount Technology (SMT): A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.
Chapter 15 The Chip Scale Package (CSP): An overview of Chip Scale Packaging, and its physical structure, electrical modeling, and performance.
Specification Update: Intel® Xeon® processor E7-8800/4800/2800 product family, clarifications, changes, and documentation errata.
Intel® Xeon® processor E7-8800/4800/2800 product family, clarifications, changes, and documentation errata.