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Hybrid Cloud Computing Resources for IT Managers from Intel

Find out how hybrid cloud solutions can help you build more flexible, elastic cloud models.

Parallel Computing: The Next Big Leap in Computing Infographic

See the performance improvement of parallel computing with code optimized to take advantage of the multiple cores of modern Intel® processors.

Silicon Design on Intel® Xeon® Processor E7-4800 v2 Product Family

Brief: Accelerate silicon design on the Intel® Xeon® processor E7-4800 v2 product family for greater throughput to bring products to market faster.

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SPAR Keeps Mission-Critical Data on the Move Case Study

Study: SPAR Magyarország uses Intel® Xeon® processor E7 family to keep mission-critical data on the move with superior performance and scalability.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 15: The Chip Scale Package (CSP)

Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

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Intel® Xeon® Processor E7-8800/4800/2800 Specification Update

Specification Update: Intel® Xeon® processor E7-8800/4800/2800 product family, clarifications, changes, and documentation errata.

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