Demonstrates the Intel® NUC and Intel® vPro™ technology capabilities for collaboration through control of meetings, screens, and rooms.
Intel’s collaboration rooms demonstrate the capabilities of the Intel® NUC and Intel® vPro™ technology in facilitating collaboration and in controlling meetings, screens, and rooms, with a small, but powerful form factor.Full View >
Case Study: AppNexus gets greater capacity and performance and lower costs with Aerospike* in-memory NoSQL database with Intel® SSD DC S3700 Series.
Case Study: Aerospike*in-memory NoSQL database with Intel® SSD DC S3700 Series provides AppNexus with greater capacity while scaling up performance, reliability, serviceability, and reducing cluster size for lower costs.
Solution Brief: Intel® SSD Data Center S3500 series-based SAN provides a low-power, low-cost, and high-IOPS solution for virtual machine datastores.
Solution Brief: Intel® SSD Data Center S3500 series-based storage area network provides a low-power, low-cost solution for virtual machine (VM) datastores and produces 250K random I/O operations per second.
Solution Blueprint: How to make high-IOPS, low-cost SAN with an Intel® SSD, Nexenta*, and VMware ESXi* 5.1, with install, setup, and connection info.
Solution Blueprint: How to build a high-IOPS, low-cost storage area network using the Intel® SSD Data Center S3500 Series, Nexenta* software stack, and VMware ESXi* 5.1, with installation, setup, and connection of NFS datastores info.
Specification Update, 2009: Intel® 5400 Express Chipset memory controller hub (MCH), clarifications, changes, and documentation errata.
Specification updates for the Intel® 5400 Express Chipset Memory Controller Hub (MCH), including device and documentation errata, specification clarification, and changes.
Intel® 6700PXH 64-bit PCI Hub device and documentation errata, specification clarifications, and changes.
This document is a compilation of device and document errata and specification clarifications and changes, and is intended for hardware system manufacturers and for software developers of applications, operating system, and tools.
Thermal and Mechanical Design Guide: Intel® 7300 Chipset Memory Controller Hub (MCH).
Discusses packaging technology, thermal simulation, specifications, metrology and solutions, and component suppliers for the Intel® 7300 Chipset Memory Controller Hub.