Thermal Mechanical Components
For the Intel® Core™ i7 processor with thermal design power of 130W (such as Intel® Core™ i7-3930K processor, Intel® Core™ i7-3820 processor, and Intel® Core™ i7-3960K processor Extreme Edition.)
Suppliers of support components have developed products for Intel® Core™ i7 processor family-based system designs. The listed vendors supply support components for processors in the 2011-land grid array (LGA) package. Some vendor products may follow design guidelines listed on the technical documents page.
Intel-Enabled Vendors
This section includes supplier information for Intel-enabled vendors for the Intel® Core™ i7 processor family for the LGA2011-0 socket. These suppliers may produce both Intel-enabled and non-Intel-enabled solutions.
Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and system integrators are responsible for thermal, mechanical, and environmental validation of these solutions.
LGA 2011-0 Socket and ILM Components
| Supplier | Part Description | Intel Part Number | Contact | Phone | |
|---|---|---|---|---|---|
| Amtek* | LGA2011-0 Square ILM |
E91838-003 |
Alvin Yap Cathy Yu |
Alvin: (86) 752 263 4562 Cathy: (86) 752 261 6809 |
alvinyap@amtek.com.cn cathy_yu@amtek.com.cn |
LGA2011-0 Backplate |
E91834-001 |
||||
Foxconn* |
LGA2011-0 Socket |
E64556-002 |
Eric Ling |
503-693-3509 x225 |
eric.ling@foxconn.com |
LGA2011-0 Square ILM |
E91838-003 |
||||
LGA2011-0 Backplate |
E91834-001 |
||||
Lotes* |
LGA2011-0 Socket | E64556-002 | Cathy Yang |
+86-20-8468 x6519 |
Cathy@lotes.com.cn |
LGA2011-0 Square ILM |
E91838-003 |
||||
LGA2011-0 Backplate |
E91834-001 |
||||
Molex* |
LGA2011-0 Socket |
E64556-002 |
Carol Liang |
+86 21 504 80889 x3301 |
carol.liang@molex.com |
| LGA2011-0 Square ILM | E91838-003 | ||||
LGA2011-0 Backplate |
E91834-001 |
||||
Tyco* |
LGA2011-0 Socket |
E64556-002 |
Alex Yeh |
+886-2-87682788 x280 |
alex.yeh@te.com |
LGA2011-0 Square ILM |
E91838-003 |
||||
LGA2011-0 Backplate |
E91834-001 |
Heatsinks for Intel® Core™ i7 Processor Family for LGA2011-0 Socket with Thermal Design Power of 130W
| Supplier | Part Description | Intel Part Number | Contact | Phone | |
|---|---|---|---|---|---|
| Foxconn* |
Desktop Radial Fin Heatsink (DRA-A) |
E94315-001 |
Cary Huang |
1 512 681 1120 |
cary.huang@foxconn.com |
| CCI (Chaun Choung Technology Corp.)* | Desktop Tall Heat Pipe Heatsink |
E77931-002 |
Monica Chih |
866-2-29952666 x1131 |
monica_chih@ccic.com.tw |
Alternate Support Components
The following suppliers have developed cooling solutions for the Intel® Core™ i7 processor-based system designs. These were independently tested by an Intel-enabled, third-party test house. These suppliers may produce both compliant and non-compliant solutions in addition to what is listed below. Please regularly consult this page for updated information on heatsink vendor status.
Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and system integrators are responsible for thermal, mechanical, and environmental validation of these solutions.
Heatsinks for Intel® Core™ i7 Processor Family for LGA2011-0 Socket with Thermal Design Power of 130W
These heatsinks were tested for compliance to thermal, mechanical, and load degradation requirements.
| Supplier | Part Number | Contact | Phone | |
|---|---|---|---|---|
| Thermalright* |
TRUE Spirit 140 |
Chris Lee |
+886-2-8663-6630#23 |
chrislee@thermalright.com |
| Thermolab* | TL1-M (bada2010) |
Chun Han Park |
+82-31-502-2665 |
chpark@thermolab.co.kr |
Zalman* |
CNPS12X |
Jinkook Kim |
+82-70-4480-7829 |
sugarman@zalman.co.kr |
Akasa* |
AK-CC6501EPO1 |
Yiyen Chen |
+886-2-2999-6289 |
sales@akasa.com.tw |
| Thermaltake* | CLP0601 | Waylon Chou | +886-2-87975788#2687 | waylon@thermaltake.com |
| Zalman* | CNPS9900 Max |
Jinkook Kim | +82-70-4480-7829 | sugarman@zalman.co.kr |
| CoolerMaster* | TPC812 | Mark Tsai | +886-2-3234-0050 | sales@coolermaster.com.tw |


