Product Collection
Intel® Server Board M50CYP Family
Status
Launched
Launch Date
Q2'21
Expected Discontinuance
2026
Limited 3-year Warranty
Yes
Extended Warranty Available for Purchase (Select Countries)
Yes
Additional Extended Warranty Details
Compatible Product Series
3rd Generation Intel® Xeon® Scalable Processors
Board Form Factor
18.79” x 16.84”
Chassis Form Factor
Rack
Socket
Socket-P4
Integrated BMC with IPMI
IPMI 2.0 & Redfish
Rack-Friendly Board
Yes
TDP
270 W
Included Items
(1) Intel® Server Board M50CYP2SB1U
Board Chipset
Target Market
Mainstream

Supplemental Information

Embedded Options Available
No
Description
Spreadcore form factor board supporting two Xeon® SP 270W TDP processors, 16 DIMMs w/ 8x Intel® Optane™ PMM capable DIMMs per CPU.
Support for EVAC heat sink

Memory Specifications

Max Memory Size (dependent on memory type)
12 TB
Memory Types
-DDR4 (RDIMM)
-3DS-RDIMM
-Load Reduced DDR4 (LRDIMM)
-3DS-LRDIMM
-Intel® Optane™ persistent memory 200 series
Max # of Memory Channels
16
Max Memory Bandwidth
3200 GB/s
Max # of DIMMs
32
ECC Memory Supported
Yes
Intel® Optane™ Persistent Memory Supported
Yes

Processor Graphics

Integrated Graphics
Yes
Graphics Output
VGA

Expansion Options

PCI Express Revision
4.0
Riser Slot 1: Total # of Lanes
32
Riser Slot 2: Total # of Lanes
32
Riser Slot 3: Total # of Lanes
16

I/O Specifications

# of USB Ports
6
USB Configuration
• Three external USB 3.0 on back panel
• One USB 3.0 port front panel
• One USB 2.0 port front panel
• One USB 2.0 internal Type-A
USB Revision
2.0 & 3.0
Total # of SATA Ports
10
# of UPI Links
3
RAID Configuration
0/1/5/10
# of Serial Ports
2

Package Specifications

Max CPU Configuration
2

Advanced Technologies

Intel® Optane™ Memory Supported
Yes
Intel® Virtualization Technology for Directed I/O (VT-d)
Yes
Intel® Remote Management Module Support
Yes
Intel® Node Manager
Yes
Intel® Advanced Management Technology
Yes

Intel® Transparent Supply Chain

TPM Version
2.0

Security & Reliability

Intel® Trusted Execution Technology
Yes