Power Analyzer Operating Conditions Report

Reports the operating conditions used during power analysis performed using the Power Analyzer. The report contains the following information:
  • Device power characteristics shows the device power characteristics as specified in the Operating Settings and Conditions page.
  • Voltages shows the voltages used during power estimation.
  • Auto computed junction temperature shows the user-entered or auto-computed temperatures used during power estimation.
Note: If you implemented a cooling solution that does not include a heat sink, the report can contain the following categories under Auto computed junction temperature:
  • Auto computed junction temperature
  • Ambient temperature
  • Board temperature
  • Junction-to-case thermal resistance
  • Case-to-heat sink thermal resistance
  • Heat sink-to-ambient thermal resistance
  • Junction-to-board thermal resistance

If you implemented a cooling solution that includes a heat sink, the report can contain the following categories:

  • Auto computed junction temperature
  • Ambient temperature
  • Junction-to-case thermal resistance
  • Case-to-ambient thermal resistance
  • Board model used shows the model of board in the design if the device family supports board modeling.