System on Chip (SoC) Interconnect
Our innovation in interconnect starts at the most foundational level: the SoC. Whether it’s within the silicon or on package, advanced interconnect means data moves faster and performance is more easily scaled. Intel’s approach to on-die interconnect and packaging unlocks new potential for design across a wide range of SoCs.
Moving data between different compute engines, memory, and I/O takes a specialized set of high-bandwidth and low-latency interconnect technologies. Our advances in processor interconnect make it possible for all these elements to come together and work as one.
Data Center Interconnect
A hyper-scale data center can have the footprint of several football fields. That creates unprecedented demand on fabric speeds and smart processing capabilities. Intel’s high-speed, long-distance interconnect technologies drive performance at large scale with computing at low latency.
The Internet of Things is driving massive growth in data generation. Wireless interconnect is the conduit connecting billions of people and things. For example, autonomous vehicles will create huge amounts of data every second, which must be captured, filtered, stored, and transmitted. We’re collaborating with technology partners to develop 5G and Wi-Fi 6 standards, enabling the next generation of wireless connectivity.
Intel is committed to developing and supporting interconnect standards for the benefit of the entire industry. Our products are built on these widely accepted standards to maximize interoperability.
Six Pillars of Technology Innovation for the Next Era of Computing
Intel is innovating across six pillars of technology development to unleash the power of data for the industry and our customers.
Notices and Disclaimers
Intel® technologies may require enabled hardware, software, or service activation.
No product or component can be absolutely secure.
Your costs and results may vary.