Sustained Operation for Intel® NUC, Intel® NUC Element, Intel® Compute Card, and Intel® Compute Stick Products
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|Intel® NUC Kits, NUC Compute Element, Compute Card and Compute Stick-Sustained Operation |
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Date: November 2021
This article covers the sustained operation of the Intel® Compute Card, Compute Stick, NUC Compute Element, and NUC kit. Sustained operation or 24x7 support. will be defined along with what is and is not included in the definition.
- For more information about the Intel® Compute Card, visit the Intel® Compute Card website.
- For more information about the Intel® Compute Stick, visit the Intel® Compute Stick website.
- For more information about the Intel® NUC Compute Element, visit the Intel® NUC Compute Element website.
- For more information about the Intel® NUC, visit the Intel® NUC website.
Sustained Operation Definition
24x7 operation for 5 years with 50% system utilization on average with an expected service rate of 1% per year during this period.
Table 1 and Table 2 provide details for this definition. Click on the topic for details:
Table 1 - What is Included
|Intel Compute Cards||All versions of the Intel Compute Card.|
|Intel Compute Card Docks||All versions of the Intel Compute Card Dock.|
|Intel Compute Sticks||All versions of the Intel Compute Sticks.|
|Intel NUC Compute Element||All versions of the Intel NUC Essentials Compute Element & Intel NUC Pro Compute Element.|
|Intel NUC Board Element||All versions of the Intel NUC Board Element.|
|Intel NUC Chassis and |
|All versions of the Intel NUC Rugged Chassis Element, Intel NUC Chassis Element & Intel NUC Assembly Element.|
|Intel NUC L10 Kits||All of the hardware components that are included in the L10 NUC Kit.|
|Intel NUC L6 Kits||All of the hardware components that are included in the L6 NUC Kit.|
|Hardware||Only the hardware that came with the Compute Card, Compute Stick, Compute Card Dock, Compute Element, Board Element, |
Rugged Chassis Element, Chassis Element, Assembly Element, L10 NUC Kit & L6 NUC Kit.
|The stock thermal solution||Changing or modifying the stock thermal solution invalidates the above 24x7 statement.|
|The stock fan||Changing or modifying the stock fan invalidates the above 24x7 statement.|
|The stock enclosure||Changing or modifying the stock enclosure invalidates the above 24x7 statement.|
Table 2 - What is Not Included
|Board only products||Integration and handling of Intel NUC board-only products may induce failures. |
|Operating System||Operating System issues cannot be covered by the above 24x7 statement.|
|Any installed software||Unknown software installation and use may also influence 24x7 operation.|
|Environmental conditions||Use of the product outside the published specifications will influence 24x7 operation.|
|Electrostatic Discharge (ESD)||Integration in an environment where electrostatic discharge is not controlled will influence 24x7 operation.|
|Electric utility power source||Inconsistent, irregular, or improperly grounded power sources will influence 24x7 operation.|
|3rd party integration process||The integration process may influence 24x7 operation.|
|Any added 3rd party components||The selection of components added to the system may influence 24x7 operation. See the Intel tested components list for suggestions.|
Product testing is a part of the development process. Tables 3 & 4 list the testing done during validation for all the products listed in this document.
Table 3 - Temperature and Humidity
|Temperature Cycling||Assesses the ability of board, components, and solder joints to withstand thermo-mechanical fatigue.|
|Thermal Baseline||Assesses the ability of heat sink and thermal interface material (thermal solution) to maintain acceptable component operating temperatures before the application of any stress conditions.|
|Bake||Assesses the impact of long-term temperature exposure on the thermal solution performance.|
|Thermal Temperature |
|Assesses the impact of long-term temperature and humidity exposure on the thermal solution performance.|
|Temperature Humidity||Ensures that the system function/cosmetics are not impacted following exposure to high temperature/humidity.|
|Operating Temperature |
|Assesses the ability of the system to function at temperature and humidity extremes.|
|Temperature and Voltage |
|Assesses the ability of the system to boot at temperature and voltage extremes on the onboard power rails.|
|Boot Cycle||Assesses the ability of the system to boot repeatedly using AC power cycles and Ctrl-Alt-Del cycles under temperature extremes.|
Each Intel NUC family undergoes MTBF testing, where 40 units are functionally tested continuously for 90 days (~86,000 accumulated hours), conforming to 50K hours of MTBF.
Table 4 - Shock and Vibration
|Drop||Assesses the ability of the system to retain functionality after multiple drops onto a concrete surface.|
|Mechanical Vibration||Examines the ability of the system to withstand mechanical vibration stress caused during shipping and use.|
|Packaged Mechanical Shock||Confirms that the product shipping package adequately protects the product against mechanical shock.|
|Packaged Mechanical |
|Confirms that the product shipping package adequately protects the product against mechanical vibration.|
|Thermal Shock||Assesses the impact of mechanical shock stress caused by shipping and use on the performance of the heatsink solution.|
|Thermal Vibration||Assesses the impact of mechanical shock stress caused by shipping and use on the performance of the heatsink solution. |
Assesses the impact of mechanical vibration stress caused by shipping and use on the performance of the heatsink solution.
A short video, Intel NUC Quality and Reliability, explains more about the process.