Article ID: 000082264 Content Type: Troubleshooting Last Reviewed: 08/11/2022

What package types will the production silicon be assembled in for 5SGXEA4H3F35I3N, 5SGXEA5H3F35I3N and 5SGXEA7H3F35I3N devices?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description

Production 5SGXEA4H3F35I3N, 5SGXEA5H3F35I3N and 5SGXEA7H3F35I3N devices will be assembled in Dual Piece Lids (DPL).

Resolution

For more information on Stratix® V device packaging, refer to the Packaging Device Information web page. 

Related Products

This article applies to 2 products

Stratix® V FPGAs
Stratix® V GT FPGA